Invention Grant
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing solid-state imaging element
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Application No.: US16730384Application Date: 2019-12-30
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Publication No.: US11333978B2Publication Date: 2022-05-17
- Inventor: Kohei Higashi , Hideki Takakuwa
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-167720JP 20170831
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G03F7/038 ; G02B5/20 ; G03F7/004 ; G03F7/039 ; H01L27/146 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38 ; G03F7/40
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition for forming a pattern used as a mask in an ion implanting, including a resin including a repeating unit having an acid-decomposable group, a photoacid generator, and an additive having a melting point or glass transition temperature of lower than 25° C. and a molecular weight of 180 or more, in which a content of the additive is 1% by mass or more with respect to a total solid content in the composition.
Information query
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