Invention Grant
- Patent Title: Package structure and method of fabricating the same
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Application No.: US15710847Application Date: 2017-09-21
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Publication No.: US11335767B2Publication Date: 2022-05-17
- Inventor: Chen-Hua Yu , Chuei-Tang Wang , Tzu-Chun Tang , Wei-Ting Chen , Chieh-Yen Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/522 ; H01L25/00 ; H01L23/28 ; H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L23/64 ; H01L21/48 ; H01L23/538 ; H01L23/498
Abstract:
A package structure has a chip, a molding compound encapsulating the chip and an inductor structure disposed above the chip. A vertical projection of the inductor structure at least partially overlaps with a vertical projection of the chip.
Public/Granted literature
- US20190035877A1 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-01-31
Information query
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