Invention Grant
- Patent Title: Low noise silicon germanium image sensor
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Application No.: US16863771Application Date: 2020-04-30
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Publication No.: US11335821B2Publication Date: 2022-05-17
- Inventor: Mamoru Iesaka , Woon Il Choi , Sohei Manabe
- Applicant: OMNIVISION TECHNOLOGIES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L31/028
- IPC: H01L31/028 ; H01L27/146

Abstract:
Low noise silicon-germanium (SiGe) image sensor. In one embodiment, an image sensor includes a plurality of pixels arranged in rows and columns of a pixel array disposed in a semiconductor substrate. The photodiodes of an individual pixel are configured to receive an incoming light through an illuminated surface of the semiconductor substrate. The semiconductor substrate includes a first layer of semiconductor material having silicon (Si); and a second layer of semiconductor material having silicon germanium (Si1-xGex). A concentration x of Ge changes gradually through at least a portion of thickness of the second layer. Each photodiode includes a first doped region extending through the first layer of semiconductor material and the second layer of semiconductor material; and a second doped region extending through the first layer of semiconductor material and the second layer of semiconductor material.
Public/Granted literature
- US20210343882A1 LOW NOISE SILICON GERMANIUM IMAGE SENSOR Public/Granted day:2021-11-04
Information query
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