Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing system, and substrate processing method
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Application No.: US17245220Application Date: 2021-04-30
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Publication No.: US11340152B2Publication Date: 2022-05-24
- Inventor: Masato Hayashi , Kohei Noguchi , Koudai Higashi , Makoto Ogata
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-009831 20190124
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G01N15/02 ; H01L21/67 ; G01N15/00

Abstract:
According to one embodiment of the present disclosure, there is provided a substrate processing apparatus comprising: a supply passage through which fluid supplied to a substrate flows; and a foreign substance detector including a channel forming part forming a portion of the supply passage, a light projector irradiating light to the channel forming part, and a light receiver receiving light emitted from the channel forming part as a result of irradiating light to the channel forming part by the light projector, the foreign substance detector being configured to detect a foreign substance in the fluid based on a signal obtained by the light that the light receiver receives, wherein the light projector and the light receiver in the foreign substance detector are disposed in areas that are not opposite to each other in areas in upper, lower, left, right, front and rear directions of the channel forming part.
Public/Granted literature
- US20210247286A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-08-12
Information query
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