- 专利标题： Integrated circuit with an interconnection system having a multilevel layer providing multilevel routing tracks and method of manufacturing the same
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申请号： US16721277申请日： 2019-12-19
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公开(公告)号： US11342261B2公开(公告)日： 2022-05-24
- 发明人: Stefan Cosemans , Julien Ryckaert , Zsolt Tokei
- 申请人： IMEC VZW
- 申请人地址： BE Leuven
- 专利权人： IMEC VZW
- 当前专利权人： IMEC VZW
- 当前专利权人地址： BE Leuven
- 代理机构： McDonnell Boehnen Hulbert & Berghoff
- 优先权： EP18214146 20181219
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/768 ; H01L23/528
摘要：
Integrated circuit comprising an interconnection system comprising at least one multilevel layer comprising first parallel electrically conductive lines, the multilevel layer comprising at least three levels forming a centerline level, an upper extension line level, and a lower extension line level the levels providing multilevel routing tracks in which the lines extend.
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