Invention Grant
- Patent Title: Integrated circuit with an interconnection system having a multilevel layer providing multilevel routing tracks and method of manufacturing the same
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Application No.: US16721277Application Date: 2019-12-19
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Publication No.: US11342261B2Publication Date: 2022-05-24
- Inventor: Stefan Cosemans , Julien Ryckaert , Zsolt Tokei
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff
- Priority: EP18214146 20181219
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768 ; H01L23/528
Abstract:
Integrated circuit comprising an interconnection system comprising at least one multilevel layer comprising first parallel electrically conductive lines, the multilevel layer comprising at least three levels forming a centerline level, an upper extension line level, and a lower extension line level the levels providing multilevel routing tracks in which the lines extend.
Information query
IPC分类:
