Invention Grant
- Patent Title: Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same
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Application No.: US16798170Application Date: 2020-02-21
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Publication No.: US11342282B2Publication Date: 2022-05-24
- Inventor: Hsu-Chiang Shih , Hung-Yi Lin , Meng-Wei Hsieh , Yu Sheng Chang , Hsiu-Chi Liu , Mark Gerber
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/48 ; H01L23/528
Abstract:
A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.
Public/Granted literature
- US20210265280A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-08-26
Information query
IPC分类:
