Invention Grant
- Patent Title: Stacked lens structure, method of manufacturing the same, and electronic apparatus
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Application No.: US16945247Application Date: 2020-07-31
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Publication No.: US11342371B2Publication Date: 2022-05-24
- Inventor: Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Masanori Iwasaki , Toshihiko Hayashi , Shuzo Sato , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Minoru Ishida
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2015-152921 20150731
- Main IPC: H01L27/146
- IPC: H01L27/146 ; B29D11/00 ; G02B13/00 ; G02B1/11
Abstract:
A deformation of a stacked lens is suppressed.
A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
Information query
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