A microelectronic device package includes a host material and a gettering material. The microelectronic device package also includes a polymeric component between the host material and the gettering material. The polymeric component substantially encapsulates the gettering material. The microelectronic device package further includes a fluorochemical lubricant. The polymeric component serves to prevent a reaction between the fluorochemical lubricant and the gettering material. Alternatively, the fluorochemical lubricant may be encapsulated by a polymeric component and may be released upon an increase in temperature during or after a packaging step.