Wet anisotropic etching of silicon

    公开(公告)号:US11959004B2

    公开(公告)日:2024-04-16

    申请号:US17339474

    申请日:2021-06-04

    CPC classification number: C09K13/02 C09K13/00 H01L21/30604 H01L21/308

    Abstract: An alkaline etching solution comprising a hydroxide salt (e.g., an alkali metal hydroxide, an ammonium hydroxide, or a combination thereof), a polyol having at least three hydroxyl (—OH) groups, and water. Also provided is a method of producing a semiconductor device by obtaining a semiconductor substrate having masked and unmasked surfaces; exposing the semiconductor substrate having the masked and unmasked surfaces to an alkaline etching solution, such that the unmasked surfaces of the substrate are anisotropically etched, wherein the alkaline etching solution comprises: a hydroxide salt; a polyol having at least three hydroxyl (—OH) groups; and water; and performing additional processing to produce the semiconductor device.

    Hermetically sealed package for mm-wave molecular spectroscopy cell

    公开(公告)号:US10364144B2

    公开(公告)日:2019-07-30

    申请号:US15815849

    申请日:2017-11-17

    Abstract: Disclosed examples provide gas cells and a method of fabricating a gas cell, including forming a cavity in a first substrate, forming a first conductive material on a sidewall of the cavity, forming a glass layer on the first conductive material, forming a second conductive material on a bottom side of a second substrate, etching the second conductive material to form apertures through the second conductive material, forming conductive coupling structures on a top side of the second substrate, and bonding a portion of the bottom side of the second substrate to a portion of the first side of the first substrate to seal the cavity.

    Selective gettering through phase segregation and temperature dependent storage and release structure for lubricant

    公开(公告)号:US11345589B2

    公开(公告)日:2022-05-31

    申请号:US16728309

    申请日:2019-12-27

    Abstract: A microelectronic device package includes a host material and a gettering material. The microelectronic device package also includes a polymeric component between the host material and the gettering material. The polymeric component substantially encapsulates the gettering material. The microelectronic device package further includes a fluorochemical lubricant. The polymeric component serves to prevent a reaction between the fluorochemical lubricant and the gettering material. Alternatively, the fluorochemical lubricant may be encapsulated by a polymeric component and may be released upon an increase in temperature during or after a packaging step.

Patent Agency Ranking