Invention Grant
- Patent Title: Semiconductor sensor and method of manufacturing the same
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Application No.: US17097175Application Date: 2020-11-13
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Publication No.: US11345590B2Publication Date: 2022-05-31
- Inventor: Chih-Fan Hu , Chia-Wei Lee , Chang-Sheng Hsu , Weng-Yi Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: TW105127460 20160826
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; G01N27/12 ; B81B3/00

Abstract:
A semiconductor sensor, comprising a gas-sensing device and an integrated circuit is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area; further includes a sensing electrode, a second TiO2-patterned portion, and a second Pt-patterned portion on the second TiO2-patterned portion in the sensing area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, a TiO2 layer formed on the IMD layer, a first TiO2-patterned portion and a first Pt-patterned portion.
Public/Granted literature
- US20210061643A1 SEMICONDUCTOR SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-03-04
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