Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US16868849Application Date: 2020-05-07
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Publication No.: US11348768B2Publication Date: 2022-05-31
- Inventor: Yuki Hosaka , Yoshihiro Umezawa , Toshiki Nakajima , Mayo Uda
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2015-043334 20150305
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/44 ; C23C16/455 ; C23C16/50

Abstract:
A plasma processing apparatus includes a processing container; a placement table provided in the processing container and including a placement region on which a workpiece is placed for a plasma processing; a baffle structure that defines a first space and a second space, and including a first member and at least one second member; a gas supply portion connected to the first space; a first pressure gauge connected to the first space; an exhaust apparatus connected to the second space; a second pressure gauge connected to the second space; a driving mechanism that moves the at least one second member in a vertical direction; a displacement gauge configured to measure a position or a distance of the second member; and a controller that controls the driving mechanism. The controller controls the driving mechanism such that a pressure of the first space becomes a predetermined pressure designated by a recipe.
Public/Granted literature
- US20200266034A1 PLASMA PROCESSING APPARATUS Public/Granted day:2020-08-20
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