Invention Grant
- Patent Title: Package spark gap structure
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Application No.: US16683125Application Date: 2019-11-13
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Publication No.: US11348882B2Publication Date: 2022-05-31
- Inventor: Aleksandar Aleksov , Feras Eid , Johanna M. Swan , Adel A. Elsherbini , Veronica Aleman Strong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H01L23/498 ; H01L23/053 ; H01L23/00
Abstract:
Embodiments may relate to a microelectronic package with an electrostatic discharge (ESD) protection structure within the package substrate. The ESD protection structure may include a cavity that has a contact of a signal line and a contact of a ground line positioned therein. Other embodiments may be described or claimed.
Public/Granted literature
- US20210143111A1 PACKAGE SPARK GAP STRUCTURE Public/Granted day:2021-05-13
Information query
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