Invention Grant
- Patent Title: Structure to enable titanium contact liner on pFET source/drain regions
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Application No.: US16719240Application Date: 2019-12-18
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Publication No.: US11349029B2Publication Date: 2022-05-31
- Inventor: Veeraraghavan S. Basker , Keith E. Fogel , Nicole S. Munro , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/08 ; H01L29/45 ; H01L29/40 ; H01L29/66

Abstract:
A semiconductor structure is provided that includes non-metal semiconductor alloy containing contact structures for field effect transistors (FETs), particularly p-type FETs. Notably, each non-metal semiconductor alloy containing contact structure includes a highly doped epitaxial semiconductor material directly contacting a topmost surface of a source/drain region of the FET, a titanium liner located on the highly doped epitaxial semiconductor material, a diffusion barrier liner located on the titanium liner, and a contact metal portion located on the diffusion barrier liner.
Information query
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