Invention Grant
- Patent Title: Method for validating measurement data
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Application No.: US16721360Application Date: 2019-12-19
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Publication No.: US11353324B2Publication Date: 2022-06-07
- Inventor: Chui-Jung Chiu , Jen-Chieh Lo , Ying-Chou Cheng , Ru-Gun Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G01B15/04
- IPC: G01B15/04 ; G01B15/00 ; H01J37/28

Abstract:
A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
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