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公开(公告)号：US20180066939A1
公开(公告)日：2018-03-08
申请号：US15811272
申请日：2017-11-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chui-Jung Chiu , Jen-Chieh Lo , Ying-Chou Cheng , Ru-Gun Liu
CPC classification number: G01B15/04 , G01B15/00 , G05B2219/37127 , G05B2219/37224 , H01J37/28
Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
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公开(公告)号：US11353324B2
公开(公告)日：2022-06-07
申请号：US16721360
申请日：2019-12-19
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chui-Jung Chiu , Jen-Chieh Lo , Ying-Chou Cheng , Ru-Gun Liu
Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
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公开(公告)号：US10520303B2
公开(公告)日：2019-12-31
申请号：US15811272
申请日：2017-11-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chui-Jung Chiu , Jen-Chieh Lo , Ying-Chou Cheng , Ru-Gun Liu
Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
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