Invention Grant
- Patent Title: Systems and methods for shuttered wafer cleaning
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Application No.: US16551352Application Date: 2019-08-26
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Publication No.: US11355366B2Publication Date: 2022-06-07
- Inventor: Tsui-Wei Wang , Yung-Li Tsai , Chui-Ya Peng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; B08B15/04
Abstract:
In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.
Public/Granted literature
- US20200075352A1 SYSTEMS AND METHODS FOR SHUTTERED WAFER CLEANING Public/Granted day:2020-03-05
Information query
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