Invention Grant
- Patent Title: Interconnect core
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Application No.: US16469073Application Date: 2017-11-27
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Publication No.: US11355458B2Publication Date: 2022-06-07
- Inventor: Jackson Chung Peng Kong , Bok Eng Cheah , Ping Ping Ooi , Kooi Chi Ooi
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2016704806 20161227
- International Application: PCT/US2017/063280 WO 20171127
- International Announcement: WO2018/125448 WO 20180705
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L21/48 ; H01L23/498 ; H01L23/00
Abstract:
A device and method of utilizing conductive thread interconnect cores. Substrates using conductive thread interconnect cores are shown. Methods of creating a conductive thread interconnect core are shown.
Public/Granted literature
- US20190295966A1 INTERCONNECT CORE Public/Granted day:2019-09-26
Information query
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