- 专利标题: LDMOS transistor and method for manufacturing the same
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申请号: US16247007申请日: 2019-01-14
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公开(公告)号: US11355631B2公开(公告)日: 2022-06-07
- 发明人: Bing Wu , Chien Ling Chan , Liang Tong
- 申请人: Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
- 申请人地址: CN Hangzhou
- 专利权人: Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
- 当前专利权人: Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
- 当前专利权人地址: CN Hangzhou
- 代理机构: Alston & Bird LLP
- 优先权: CN201810055437.3 20180119
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L29/40 ; H01L29/08 ; H01L21/265 ; H01L21/3213 ; H01L21/308 ; H01L29/417 ; H01L29/06 ; H01L21/266
摘要:
An LDMOS transistor and a method for manufacturing the same are provided. The method includes: forming an epitaxial layer on a substrate, forming a gate structure on an upper surface of the epitaxial layer, forming a body region and a drift region in the epitaxial layer, forming a source region in the body region, forming a first insulating layer on the gate structure and an upper surface of the epitaxial layer and, forming a shield conductor layer on the first insulating layer, forming a second insulating layer covering the shield conductor layer, forming a first conductive path, to connect the source region with the substrate, and forming a drain region in the drift region. By forming the first conductive path which connects the source region with the substrate, the size of the LDMOS transistor and the resistance can be reduced.
公开/授权文献
- US20190229212A1 LDMOS Transistor And Method For Manufacturing The Same 公开/授权日:2019-07-25
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