Invention Grant
- Patent Title: Electronic device fabric integration
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Application No.: US16567479Application Date: 2019-09-11
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Publication No.: US11360512B2Publication Date: 2022-06-14
- Inventor: Nadine L. Dabby , Sasha N. Oster , Aleksandar Aleksov , Braxton Lathrop , Racquel L Fygenson
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; G06F1/16 ; H05K3/34 ; H05K3/32 ; H05K1/03 ; H05K1/02 ; H05K3/28

Abstract:
Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.
Public/Granted literature
- US20200004290A1 ELECTRONIC DEVICE FABRIC INTEGRATION Public/Granted day:2020-01-02
Information query