- 专利标题： Method for manufacturing insulating film and semiconductor package
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申请号： US16326073申请日： 2018-07-02
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公开(公告)号： US11361878B2公开(公告)日： 2022-06-14
- 发明人: Woo Jae Jeong , You Jin Kyung , Byung Ju Choi , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong
- 申请人： LG CHEM, LTD.
- 申请人地址： KR Seoul
- 专利权人： LG CHEM, LTD.
- 当前专利权人： LG CHEM, LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权： KR10-2017-0089707 20170714
- 国际申请： PCT/KR2018/007478 WO 20180702
- 国际公布： WO2019/013482 WO 20190117
- 主分类号： H01B3/32
- IPC分类号： H01B3/32 ; H01L23/31 ; H01L23/532 ; H01L23/00 ; H01L21/56 ; H01B3/30 ; G03F7/40 ; G03F7/30
摘要：
The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.