公开(公告)号：US11993731B2

公开(公告)日：2024-05-28

申请号：US17266023

申请日：2020-06-05

Applicant: LG CHEM, LTD.

Inventor： Junghak Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Minsu Jeong ,  Ju Hyeon Kim ,  Youngsam Kim

IPC: C09J163/00 ,  C08G59/30 ,  C08G59/32 ,  C08G77/14 ,  C08L33/20 ,  C08L63/00 ,  C08L83/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/30 ,  C09J11/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/20 ,  C09J183/06 ,  C09J183/12

CPC classification number: C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06 ,  C09J2203/326

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

公开(公告)号：US12286564B2

公开(公告)日：2025-04-29

申请号：US17266864

申请日：2020-05-08

Applicant: LG CHEM, LTD.

Inventor： Youngsam Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Minsu Jeong ,  Junghak Kim ,  Ju Hyeon Kim

IPC: C09J163/04 ,  C09J7/10 ,  C09J11/04 ,  C09J11/08 ,  H01L23/00

Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

公开(公告)号：US10795259B2

公开(公告)日：2020-10-06

申请号：US15764544

申请日：2017-02-03

Applicant: LG CHEM, LTD.

Inventor： Byung Ju Choi ,  You Jin Kyung ,  Woo Jae Jeong ,  Bo Yun Choi ,  Min Su Jeong

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  C08F2/50 ,  C08F2/44 ,  H05K3/34 ,  C08L35/02 ,  C09D4/00 ,  C08K7/00 ,  C08F122/14 ,  C08K3/34 ,  H05K3/28

Abstract: The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

公开(公告)号：US09788434B2

公开(公告)日：2017-10-10

申请号：US14763414

申请日：2014-09-22

Applicant: LG CHEM, LTD.

Inventor： Min Su Jeong ,  You Jin Kyung ,  Byung Ju Choi ,  Woo Jae Jeong ,  Bo Yun Choi ,  Kwang Joo Lee ,  Se Jin Ku

IPC: G03F7/11 ,  G06F7/40 ,  H05K3/02 ,  H05K3/28 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L21/48 ,  G03F7/027 ,  G03F7/09 ,  H05K3/34

CPC classification number: H05K3/027 ,  G03F7/027 ,  G03F7/038 ,  G03F7/09 ,  G03F7/16 ,  G03F7/20 ,  G03F7/327 ,  G03F7/40 ,  H01L21/4846 ,  H05K3/281 ,  H05K3/3452

Abstract: The present invention relates to a preparation method for a dry film solder resist (DFSR) capable of forming the DFSR having fine unevenness on a surface by a more simplified method, and a film laminate used therein. The preparation method for a dry film solder resist includes forming a predetermined photo-curable and heat-curable resin composition on a transparent carrier film having a surface on which a fine unevenness having an average roughness (Ra) of 200 nm to 2 μm is formed; laminating the resin composition on a substrate to form a laminated structure in which the substrate, the resin composition, and the transparent carrier film are sequentially formed; exposing the resin composition and delaminating the transparent carrier film; and alkaline-developing the resin composition in a non-exposure part and performing heat-curing.

公开(公告)号：US11702520B2

公开(公告)日：2023-07-18

申请号：US16767808

申请日：2019-01-09

Applicant: LG CHEM, LTD.

Inventor： Minsu Jeong ,  You Jin Kyung ,  Byung Ju Choi ,  Woo Jae Jeong ,  Kwang Joo Lee ,  Eunbyurl Cho

IPC: C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/29

CPC classification number: C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/295 ,  C08J2363/00 ,  C08K2201/003

Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

公开(公告)号：US11515245B2

公开(公告)日：2022-11-29

申请号：US16767872

申请日：2018-12-12

Applicant: LG CHEM, LTD.

Inventor： Minsu Jeong ,  You Jin Kyung ,  Byung Ju Choi ,  Woo Jae Jeong ,  Kwang Joo Lee ,  Eunbyurl Cho

IPC: H01L23/498 ,  B29C65/02

Abstract: The present invention relates to a method for manufacturing an insulating layer for a semiconductor package which can improve reliability and have excellent heat resistance by removing pores generated in the insulating layer during manufacture of an insulating layer for a semiconductor package using magnetic characteristics, and an insulating layer for a semiconductor package obtained using the method for manufacturing the insulating layer for a semiconductor package.

公开(公告)号：US09778566B2

公开(公告)日：2017-10-03

申请号：US14925389

申请日：2015-10-28

Applicant: LG CHEM, LTD.

Inventor： Byung Ju Choi ,  You Jin Kyung ,  Woo Jae Jeong ,  Bo Yun Choi ,  Kwang Joo Lee ,  Min Su Jeong

IPC: G03F7/032 ,  G03F7/028 ,  G03F7/004 ,  G03F7/027 ,  G03F7/031 ,  G03F7/038 ,  G03F7/029

CPC classification number: G03F7/032 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/028 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038

Abstract: Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator, and a dry film solder resist manufactured therefrom.

公开(公告)号：US12024654B2

公开(公告)日：2024-07-02

申请号：US17286673

申请日：2020-06-12

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Ji Ho Han ,  Bora Yeon ,  Mi Jang

IPC: C09J163/00 ,  C09J7/24 ,  H01L23/00 ,  C08K5/29 ,  C09J7/40

CPC classification number: C09J163/00 ,  C09J7/245 ,  H01L24/27 ,  H01L24/29 ,  C08K5/29 ,  C09J7/40 ,  C09J2433/00 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2924/0665

Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

公开(公告)号：US11527503B2

公开(公告)日：2022-12-13

申请号：US16972528

申请日：2020-01-23

Applicant: LG CHEM, LTD.

Inventor： You Jin Kyung ,  Minsu Jeong ,  Kwang Joo Lee

IPC: H01L21/30 ,  H01L23/00

Abstract: The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.

公开(公告)号：US11361878B2

公开(公告)日：2022-06-14

申请号：US16326073

申请日：2018-07-02

Applicant: LG CHEM, LTD.

Inventor： Woo Jae Jeong ,  You Jin Kyung ,  Byung Ju Choi ,  Bo Yun Choi ,  Kwang Joo Lee ,  Min Su Jeong

IPC: H01B3/32 ,  H01L23/31 ,  H01L23/532 ,  H01L23/00 ,  H01L21/56 ,  H01B3/30 ,  G03F7/40 ,  G03F7/30

Abstract: The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.