公开(公告)号：US11702571B2

公开(公告)日：2023-07-18

申请号：US16762863

申请日：2019-03-28

申请人： LG CHEM, LTD.

发明人： Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee

IPC分类号： C09J7/22 ,  C09J7/40 ,  C09J133/08 ,  C09J133/24 ,  C09J7/38 ,  C09J167/02 ,  H01L21/683

CPC分类号： C09J7/22 ,  C09J7/385 ,  C09J7/40 ,  C09J133/08 ,  C09J133/24 ,  C09J167/02 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/208 ,  C09J2301/312 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68386

摘要： An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

公开(公告)号：US11479699B2

公开(公告)日：2022-10-25

申请号：US16957494

申请日：2018-12-20

申请人： LG CHEM, LTD.

发明人： Jong Min Jang ,  Heejung Kim ,  Kwang Joo Lee

IPC分类号： C09J133/10 ,  C09J7/10 ,  C08L33/10 ,  C08L63/10 ,  C09J11/04 ,  C09J11/08

摘要： The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

公开(公告)号：US11466184B2

公开(公告)日：2022-10-11

申请号：US17045865

申请日：2019-06-17

申请人： LG CHEM, LTD.

发明人： Mi Jang ,  Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee ,  Bora Yeon ,  Kwang Su Seo

IPC分类号： C09J143/04 ,  C09J11/06 ,  C09J183/06 ,  C08F230/08 ,  C08K5/00 ,  C08F8/30 ,  C08K5/17

摘要： The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

公开(公告)号：US10991678B2

公开(公告)日：2021-04-27

申请号：US16884559

申请日：2020-05-27

申请人： LG Chem, Ltd.

发明人： Jung Hak Kim ,  Hee Jung Kim ,  Se Ra Kim ,  Jung Ho Jo ,  Kwang Joo Lee ,  Seung Hee Nam ,  Young Kook Kim

IPC分类号： H01L21/56 ,  H01L25/065 ,  H01L23/00 ,  H01L23/28 ,  H01L23/495 ,  H01L23/31 ,  H01L25/00

摘要： The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

公开(公告)号：US09389504B2

公开(公告)日：2016-07-12

申请号：US14379720

申请日：2013-02-20

申请人： LG CHEM, LTD.

发明人： Se-Jin Ku ,  Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang Joo Lee ,  Min-Su Jeong

IPC分类号： G03F7/029 ,  G03F7/032 ,  C08F2/50 ,  C08F2/46 ,  C09D179/04 ,  C08G73/06

CPC分类号： G03F7/029 ,  C08G73/0644 ,  C08G73/065 ,  C08G73/0655 ,  C09D179/04 ,  G03F7/032 ,  C08L63/00

摘要： The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.

摘要翻译： 本发明涉及能够提供玻璃化转变温度高，耐热可靠性提高的干膜阻焊剂的光固化型和热固化性树脂组合物，以及干膜阻焊剂。 所述树脂组合物可以包括酸改性低聚物，其包含具有羧基（-COOH）和可光固化不饱和官能团的亚氨基碳酸酯基化合物，具有两个或更多个可光固化不饱和官能团的光聚合单体， 具有可热固化官能团的热固性粘合剂和光引发剂。

公开(公告)号：US11993731B2

公开(公告)日：2024-05-28

申请号：US17266023

申请日：2020-06-05

申请人： LG CHEM, LTD.

发明人： Junghak Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Minsu Jeong ,  Ju Hyeon Kim ,  Youngsam Kim

IPC分类号： C09J163/00 ,  C08G59/30 ,  C08G59/32 ,  C08G77/14 ,  C08L33/20 ,  C08L63/00 ,  C08L83/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/30 ,  C09J11/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/20 ,  C09J183/06 ,  C09J183/12

CPC分类号： C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06 ,  C09J2203/326

摘要： The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

公开(公告)号：US11178730B2

公开(公告)日：2021-11-16

申请号：US16084185

申请日：2016-12-23

申请人： LG CHEM, LTD.

发明人： Ji Eun Myung ,  Sera Kim ,  Jooyeon Kim ,  Chang Yoon Lim ,  Seung Heon Lee ,  Mun Seop Song ,  Kwang Joo Lee ,  Ji Young Hwang

IPC分类号： H05B3/84 ,  C23F1/02 ,  H05B3/26

摘要： The present specification relates to a heating element and a method for manufacturing the same.

公开(公告)号：US11021634B2

公开(公告)日：2021-06-01

申请号：US15571210

申请日：2016-09-23

申请人： LG CHEM, LTD.

发明人： Jung Hak Kim ,  Hee Jung Kim ,  Se Ra Kim ,  Kwang Joo Lee ,  Young Kook Kim ,  Seung Hee Nam

IPC分类号： C09J163/10 ,  C09J7/10 ,  C09J133/04 ,  C08G59/62 ,  H01L25/07 ,  H01L25/065 ,  H01L23/482 ,  H01L23/00 ,  C09J163/00

摘要： The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

公开(公告)号：US10920109B2

公开(公告)日：2021-02-16

申请号：US15752151

申请日：2017-03-28

申请人： LG CHEM, LTD.

发明人： Jung Hak Kim ,  Hee Jung Kim ,  Seung Hee Nam ,  Kwang Joo Lee ,  Se Ra Kim ,  Young Kook Kim

IPC分类号： H01L23/14 ,  C09J7/10 ,  C09J7/30 ,  C09J11/06 ,  C09J11/04 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  C09J163/04 ,  H01L23/495 ,  H01L23/00 ,  C08G59/62

摘要： The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

公开(公告)号：US10253223B2

公开(公告)日：2019-04-09

申请号：US15752666

申请日：2017-03-31

申请人： LG CHEM, LTD.

发明人： Jung Hak Kim ,  Hee Jung Kim ,  Se Ra Kim ,  Kwang Joo Lee ,  Seung Hee Nam ,  Young Kook Kim

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C09J133/10 ,  C09J163/04 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  C08G59/62 ,  C09J163/00

摘要： The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.