Invention Grant
- Patent Title: Board-to-board connector
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Application No.: US17184838Application Date: 2021-02-25
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Publication No.: US11367973B2Publication Date: 2022-06-21
- Inventor: Junji Oosaka , Yuichi Takenaga , Akihiro Matsunaga
- Applicant: Japan Aviation Electronics Industry, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2020-058408 20200327
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71 ; H01R12/70 ; H01R13/50 ; H01R13/41 ; H01R43/20 ; H05K1/18 ; H01R13/24 ; H01R12/57 ; H01R13/621 ; H01R13/631

Abstract:
A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.
Public/Granted literature
- US20210305733A1 BOARD-TO-BOARD CONNECTOR Public/Granted day:2021-09-30
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