- 专利标题: Zipper tape, bag with zipper tape, method for manufacturing bag with zipper tape, long member-bonding method capable of favorably bonding long members, device therefor, and zipper tape-bonding device
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申请号: US15565073申请日: 2016-04-07
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公开(公告)号: US11370064B2公开(公告)日: 2022-06-28
- 发明人: Ryo Katada , Shuichi Goto , Koji Kakigami , Yoshinori Namba
- 申请人: IDEMITSU UNITECH CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: IDEMITSU UNITECH CO., LTD.
- 当前专利权人: IDEMITSU UNITECH CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Millen, White, Zelano & Branigan, PC
- 代理商 Ryan Pool
- 优先权: JP2015-079633 20150408,JPJP2015-079632 20150408
- 国际申请: PCT/JP2016/061459 WO 20160407
- 国际公布: WO2016/163487 WO 20161013
- 主分类号: B23K26/354
- IPC分类号: B23K26/354 ; B31B70/81 ; B29C65/14 ; B23K20/00 ; B31B50/81 ; B65D33/25 ; B65B61/18
摘要:
A light-absorbing layer and a bonding layer are layered on a first side of each of a belt-shaped male base portion integrated with a male portion and a female base portion integrated with a female portion on a side of the male and female base portions opposite the first side. The light-absorbing layer contains a light-absorbing material having a wavelength absorption range from 800 nm to 1200 nm to absorb a laser beam of the range. The bonding layer contains a low-melting-point resin in a form of a metallocene linear low-density polyethylene having a melting point ranging from 60 degrees C. to 120 degrees C. When the zipper tape is bonded to the base film, the laser beam is applied to heat the light-absorbing layer to melt the bonding layer. The melted bonding layer is pressure-bonded to the base film. The base film can be bonded without causing thermal degradation.
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