Invention Grant
- Patent Title: Semiconductor package with layer structures, antenna layer and electronic component
-
Application No.: US16994764Application Date: 2020-08-17
-
Publication No.: US11373957B2Publication Date: 2022-06-28
- Inventor: Wen-Sung Hsu , Tao Cheng , Nan-Cheng Chen , Che-Ya Chou , Wen-Chou Wu , Yen-Ju Lu , Chih-Ming Hung , Wei-Hsiu Hsu
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK Inc.
- Current Assignee: MEDIATEK Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/498 ; H01L23/50 ; H01L23/66 ; H01L25/065 ; H01L25/10 ; H01L25/16 ; H01L25/00 ; H01Q1/22 ; H01Q9/04 ; H01L23/14 ; H01L23/00 ; H01Q21/06
Abstract:
A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.
Public/Granted literature
- US20200381365A1 SEMICONDUCTOR PACKAGE Public/Granted day:2020-12-03
Information query
IPC分类:
