- 专利标题: Light emitting device package
-
申请号: US16646623申请日: 2018-09-14
-
公开(公告)号: US11373973B2公开(公告)日: 2022-06-28
- 发明人: June O Song , Ki Seok Kim , Chang Man Lim
- 申请人: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- 申请人地址: CN Suzhou
- 专利权人: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- 当前专利权人: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- 当前专利权人地址: CN Suzhou
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR10-2017-0118981 20170915
- 国际申请: PCT/KR2018/010827 WO 20180914
- 国际公布: WO2019/054793 WO 20190321
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L33/48 ; H01L33/60 ; H01L33/62 ; H01L33/50
摘要:
A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening. According to the embodiment, the upper surface of the first package body may be coupled to the lower surface of the second package body, the first package body may include a recess recessed from the upper surface of the first package body to the lower surface of the first package body, the first resin may be disposed in the recess, the first resin and the second resin include materials different from each other, and the first resin may be in contact with the light emitting device and the second resin.
公开/授权文献
- US20200227373A1 LIGHT EMITTING DEVICE PACKAGE 公开/授权日:2020-07-16
信息查询
IPC分类: