Invention Grant
- Patent Title: Camera module capable of dissipating heat and electronic device using the same
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Application No.: US16727740Application Date: 2019-12-26
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Publication No.: US11375604B2Publication Date: 2022-06-28
- Inventor: Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma
- Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Applicant Address: CN Shenzhen
- Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Current Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Current Assignee Address: CN Shenzhen
- Agency: ScienBiziP, P.C.
- Priority: CN201911033357.9 20191028
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/02 ; G02B7/04 ; G02B7/02 ; H05K1/18 ; G02B5/20 ; H01L35/32
Abstract:
A camera module includes a printed circuit board, a sensor, and a refrigeration chip. A first receiving groove is defined in the printed circuit board. The sensor is received in the first receiving groove and electrically connected to the printed circuit board. The refrigeration chip is formed on and electrically connected to the printed circuit board. The refrigeration chip comprises a cold surface. The sensor is formed on the cold surface. The cold surface is configured to absorb heat from the sensor when the refrigeration chip is powered on. The camera module is capable of dissipating heat and controlling an internal temperature of the camera module.
Public/Granted literature
- US20210127477A1 CAMERA MODULE CAPABLE OF DISSIPATING HEAT AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2021-04-29
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