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公开(公告)号：US11381148B2
公开(公告)日：2022-07-05
申请号：US16568937
申请日：2019-09-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Shin-Wen Chen , Long-Fei Zhang , Kun Li , Xiao-Mei Ma
IPC: H02K41/03 , H02K41/00 , H02K41/035 , H02K11/40 , H02K41/02
Abstract: A camera module shielded against electromagnetic interference but of reduced size comprises a voice coil motor, a circuit board, and a base between voice coil motor and circuit board. The voice coil motor comprises conductive housing. The circuit board comprises a conductive wire itself comprising shielded wire, ground pad, and a surrounding and grounded closed ground loop. The base comprises a main body and a conductive loop sleeved thereon. A first side of the conductive loop is electrically connected to the conductive housing, a second side of the conductive loop is electrically connected to the closed ground loop. The conductive housing, the conductive loop, and the closed ground loop form a shield against electromagnetic interference. The disclosure further provides an electronic device including the camera module.
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公开(公告)号：US11375604B2
公开(公告)日：2022-06-28
申请号：US16727740
申请日：2019-12-26
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma
Abstract: A camera module includes a printed circuit board, a sensor, and a refrigeration chip. A first receiving groove is defined in the printed circuit board. The sensor is received in the first receiving groove and electrically connected to the printed circuit board. The refrigeration chip is formed on and electrically connected to the printed circuit board. The refrigeration chip comprises a cold surface. The sensor is formed on the cold surface. The cold surface is configured to absorb heat from the sensor when the refrigeration chip is powered on. The camera module is capable of dissipating heat and controlling an internal temperature of the camera module.
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公开(公告)号：US10972646B2
公开(公告)日：2021-04-06
申请号：US16681948
申请日：2019-11-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Shin-Wen Chen , Xiao-Mei Ma , Long-Fei Zhang , Kun Li
Abstract: A device with two cameras utilizing one photosensitive assembly includes a first camera assembly, a second camera assembly, and the photosensitive assembly. The first camera assembly and the second camera assembly are symmetrically positioned at both sides of the photosensitive assembly. The photosensitive assembly includes a driver and a connected photosensitive chip, the driver can drive the photosensitive chip to rotate, so that a photosensitive surface of the photosensitive chip is rotated between the first camera assembly and the second camera assembly. Therefore, the first camera assembly and the second camera assembly of the camera device are able to share one photosensitive chip, thereby the overall size and cost of the camera device is reduced. The present application also provides a mobile terminal having the camera device.
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公开(公告)号：US10948805B2
公开(公告)日：2021-03-16
申请号：US16121809
申请日：2018-09-05
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
Abstract: A camera module which is sealed and given protection against damage from forcible impacts includes a lens module, a lens tube, and a protecting cover. The lens module has lens screw threads on its outer wall. The lens tube includes a lens receiving space, the lens module is received in the lens receiving space, lens tube screw threads are formed on an inner wall of the lens receiving space. The lens tube screw threads match the lens screw threads. The protecting cover includes a cushioning portion and a dustproofing portion. The cushioning portion and the dustproofing portion are attached to and cover the outer exposed surfaces of the lens tube. The dustproofing portion covers the lens thread and the lens tube screw threads.
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公开(公告)号：US10897188B2
公开(公告)日：2021-01-19
申请号：US16561386
申请日：2019-09-05
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
IPC: H02K41/035 , H04N5/225 , G02B7/08
Abstract: A voice coil motor in a camera module with a means of being mounted robustly on a base comprises a casing and the base. The casing is hollow, the casing comprises a top surface and a side wall around the top surface. The base comprises a base portion and projections, the base portion being in contact with the side wall of the casing and engaged with the casing to form a cavity. The side wall is provided with recesses external to the cavity to accept the projections, the projections lending structural reinforcement to the casing.
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Patent Agency Ranking
公开(公告)号：US10827105B1
公开(公告)日：2020-11-03
申请号：US16539037
申请日：2019-08-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Kun Li , Shin-Wen Chen , Xiao-Mei Ma , Long-Fei Zhang
Abstract: A less conspicuous lens module able to approach closer to a corner of a display screen on an electronic device includes a circuit board, a carrier, and a lens assembly. The circuit board includes a first hard board portion. The carrier is disposed on the first hard board portion, and the lens assembly is disposed on the carrier. The first hard board portion, the carrier, and the lens assembly all have a cutaway structure at their edges. The cutaway structures of the first hard board portion, the carrier, and the lens assembly are consistent in shape and size and are aligned with each other. An electronic device using such a lens module is also provided.
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公开(公告)号：US10823973B2
公开(公告)日：2020-11-03
申请号：US16435994
申请日：2019-06-10
Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
Abstract: A light projecting module for use in electronic devices, the light projecting module including a circuit board having a laser light source, a seat mounted on the circuit board, a transparent conductive film mounted on a surface of the seat away the circuit board, at least one conductive layer formed on the seat and having first and second end portions, at least one conductive ball electrically connecting the first end portion to the transparent conductive film, and at least one insulating colloid formed at a junction of the transparent conductive film, the first end portion, and the conductive ball. The second end portion of the at least one conductive layer is electrically connected to the circuit board.
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公开(公告)号：US10768392B2
公开(公告)日：2020-09-08
申请号：US16185052
申请日：2018-11-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Long-Fei Zhang , Shin-Wen Chen , Kun Li , Xiao-Mei Ma
Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.
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公开(公告)号：US10666843B2
公开(公告)日：2020-05-26
申请号：US16165824
申请日：2018-10-19
Inventor： Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma
IPC: H04N5/225 , H01L27/146 , H01R12/77
Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
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公开(公告)号：US11778301B2
公开(公告)日：2023-10-03
申请号：US17557033
申请日：2021-12-20
Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
CPC classification number: H04N23/57 , G02B7/08 , H02K5/04 , H02K41/0354 , H02P7/025 , H04N23/52 , H04N23/54 , G03B2205/0069
Abstract: A voice coil motor strongly attached to the base of a camera module comprises the base and a casing. The casing and the base are interlocked with each other. The casing is a hollow structure. The casing comprises a top surface and a side wall surrounding the top surface. The side wall and the base are engaged with each other. The side wall is extended in parts to form at least one extending leg. The extending leg extends to a side of the base away from the top surface and is bent toward the base.
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