公开(公告)号：US11366282B2

公开(公告)日：2022-06-21

申请号：US16903155

申请日：2020-06-16

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Sheng-Jie Ding ,  Shin-Wen Chen ,  Jing-Wei Li ,  Jian-Chao Song ,  Ke-Hua Fan

IPC: G02B7/02

Abstract: A lens module includes a lens holder, a filter, and a metal support. The lens holder includes a groove and sidewalls surrounding to form the groove. The metal support includes a support plate, heat dissipation plates, and heat transfer plates. At least one first mounting hole is formed on the sidewalls. The support plate comprises a support portion and a connecting portion connecting to each other. The connecting portion connects the support portion and each of the heat transfer plates. An opening is formed on the support portion and passes through the support portion. The filter is located on the support portion and covers the opening. The heat transfer plates are installed in the at least one first mounting hole. The support plate is received in the groove. The heat dissipation plates are located outside the lens holder. The disclosure also provides an electronic device having the lens module.

公开(公告)号：US11181711B2

公开(公告)日：2021-11-23

申请号：US16854003

申请日：2020-04-21

Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

Inventor： Long-Fei Zhang ,  Shin-Wen Chen ,  Kun Li ,  Xiao-Mei Ma ,  Hao-Zhong Liu

IPC: G02B7/02

Abstract: A lens module includes a lens assembly and a lens barrel assembly receiving the lens assembly. The lens barrel assembly includes a lens holder and a lens barrel provided on the lens holder. A light transmission hole is defined passing through the lens holder and the lens barrel. The lens assembly is received in the light transmission hole. A center of the lens barrel is offset from a center of the lens holder.

公开(公告)号：US11029492B2

公开(公告)日：2021-06-08

申请号：US16560004

申请日：2019-09-04

Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

Inventor： Kun Li ,  Shin-Wen Chen ,  Long-Fei Zhang ,  Xiao-Mei Ma

IPC: G02B13/00 ,  G02B6/44 ,  H04N5/225 ,  G02B5/20

Abstract: A lens module includes a circuit board, a carrier, and an optical filter. The carrier is fixed on a surface of the circuit board. The carrier defines a through hole. The optical filter is mounted on the carrier. The carrier defines at least one gas escape structure. A receiving space is between the optical filter and the circuit board, and the gas escape structure communicates with the receiving space to release water vapor in the receiving space and allow air pressure equalization and thus the relief of stress. The disclosure further provides an electronic device including the lens module.

公开(公告)号：US10951798B2

公开(公告)日：2021-03-16

申请号：US15859771

申请日：2018-01-02

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Xiao-Mei Ma ,  Shin-Wen Chen ,  Sheng-Jie Ding

IPC: H04N5/225

Abstract: A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.

公开(公告)号：US10749046B2

公开(公告)日：2020-08-18

申请号：US16201959

申请日：2018-11-27

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Chia-Wei Chen ,  Shin-Wen Chen

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/18

Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.

公开(公告)号：US10574875B2

公开(公告)日：2020-02-25

申请号：US16170037

申请日：2018-10-25

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Chia-Wei Chen ,  Shin-Wen Chen ,  Ding-Nan Huang

IPC: H04N5/225 ,  H04N5/232 ,  G03B3/10 ,  G03B7/02 ,  G02B7/02

Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.

公开(公告)号：US10274812B1

公开(公告)日：2019-04-30

申请号：US15832596

申请日：2017-12-05

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Shin-Wen Chen

IPC: G03B17/00 ,  G03B17/12 ,  H05K1/18 ,  G02B7/02 ,  H04N5/225

Abstract: A durable camera module comprises a lens holder and a lens barrel. An opening is defined in the lens holder. The opening passes through the lens holder along an axial direction of the lens holder. At least one notch is defined in a side wall of the lens holder. The at least one notch extends radially through the side wall of the lens holder. The lens barrel is received in the opening. A first adhesive layer is formed between the lens barrel and lens holder. The first adhesive layer is positioned at an end of the lens holder and surrounds the lens barrel. A second adhesive layer is formed in each of the at least one notch, the second adhesive layer is bonded to the lens barrel.

公开(公告)号：US12124101B2

公开(公告)日：2024-10-22

申请号：US17719515

申请日：2022-04-13

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Yu-Shuai Li ,  Shin-Wen Chen ,  Jing-Wei Li ,  Jian-Chao Song

IPC: H04N5/335 ,  G02B7/02 ,  G03B30/00 ,  H04N23/55

CPC classification number: G02B7/021 ,  G03B30/00 ,  H04N23/55

Abstract: A lens base with improved strength and reduced size includes a bracket and a lens holder connected to the bracket. The bracket includes a cover plate and a side plate, the side plate connects to the cover plate to form a receiving groove, the cover plate defines a first aperture, the first aperture penetrates the cover plate. The lens holder faces away from the receiving groove, the lens holder defines a second aperture, the second aperture faces the first aperture.

公开(公告)号：US11778301B2

公开(公告)日：2023-10-03

申请号：US17557033

申请日：2021-12-20

Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

Inventor： Xiao-Mei Ma ,  Shin-Wen Chen ,  Long-Fei Zhang ,  Kun Li

IPC: H02K41/035 ,  H02K5/04 ,  H04N23/57 ,  H02P7/025 ,  G02B7/08 ,  H04N23/52 ,  H04N23/54

CPC classification number: H04N23/57 ,  G02B7/08 ,  H02K5/04 ,  H02K41/0354 ,  H02P7/025 ,  H04N23/52 ,  H04N23/54 ,  G03B2205/0069

Abstract: A voice coil motor strongly attached to the base of a camera module comprises the base and a casing. The casing and the base are interlocked with each other. The casing is a hollow structure. The casing comprises a top surface and a side wall surrounding the top surface. The side wall and the base are engaged with each other. The side wall is extended in parts to form at least one extending leg. The extending leg extends to a side of the base away from the top surface and is bent toward the base.

公开(公告)号：US11665815B2

公开(公告)日：2023-05-30

申请号：US17530695

申请日：2021-11-19

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

Inventor： Long-Fei Zhang ,  Jian-Chao Song ,  Jing-Wei Li ,  Sheng-Jie Ding ,  Shin-Wen Chen ,  Ding-Nan Huang

IPC: G02B7/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H04M1/02

CPC classification number: H05K1/0271 ,  G02B7/025 ,  H04M1/0264 ,  H05K1/115 ,  H05K1/181 ,  G02B7/02 ,  H05K2201/10121

Abstract: A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.