- 专利标题: Battery protection circuit package and method of fabricating the same
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申请号: US16907474申请日: 2020-06-22
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公开(公告)号: US11375623B2公开(公告)日: 2022-06-28
- 发明人: Hyuk Hwi Na , Ho Seok Hwang , Young Seok Kim , Sang Hoon Ahn , Jae Ku Park , Sung Hee Wang , Eun Bin Lee
- 申请人: ITM SEMICONDUCTOR CO., LTD.
- 申请人地址: KR Chungcheongbuk-do
- 专利权人: ITM SEMICONDUCTOR CO., LTD.
- 当前专利权人: ITM SEMICONDUCTOR CO., LTD.
- 当前专利权人地址: KR Chungcheongbuk-do
- 代理机构: Mayer & Williams PC
- 代理商 Stuart H. Mayer
- 优先权: KR10-2019-0084062 20190711
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H01M50/572 ; H01L23/495 ; H01M10/42 ; H02J7/00 ; H05K1/11 ; H05K3/28
摘要:
A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.
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