Invention Grant
- Patent Title: Double-sided probe systems with thermal control systems and related methods
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Application No.: US17111283Application Date: 2020-12-03
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Publication No.: US11378619B2Publication Date: 2022-07-05
- Inventor: Masahiro Sameshima
- Applicant: FormFactor, Inc.
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Dascenzo Gates Intellectual Property Law, P.C.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/44 ; G01R31/319

Abstract:
Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
Public/Granted literature
- US20210190860A1 DOUBLE-SIDED PROBE SYSTEMS WITH THERMAL CONTROL SYSTEMS AND RELATED METHODS Public/Granted day:2021-06-24
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