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公开(公告)号:US11378619B2
公开(公告)日:2022-07-05
申请号:US17111283
申请日:2020-12-03
Applicant: FormFactor, Inc.
Inventor: Masahiro Sameshima
IPC: G01R31/28 , G01R1/44 , G01R31/319
Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
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公开(公告)号:US20210190860A1
公开(公告)日:2021-06-24
申请号:US17111283
申请日:2020-12-03
Applicant: FormFactor, Inc.
Inventor: Masahiro Sameshima
IPC: G01R31/28 , G01R31/319 , G01R1/44
Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
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