Invention Grant
- Patent Title: High connector count mating compliance
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Application No.: US16847924Application Date: 2020-04-14
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Publication No.: US11381017B2Publication Date: 2022-07-05
- Inventor: John Franz , Brian T. Purcell , Paul Danna
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Nolte Intellectual Property Law Group
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/72 ; H05K1/18 ; H05K1/02 ; H01R31/06 ; H01R12/73 ; H01R13/518

Abstract:
A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.
Public/Granted literature
- US20210320443A1 HIGH CONNECGOR COUNT MATING COMPLIANCE Public/Granted day:2021-10-14
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