Invention Grant
- Patent Title: Printed wiring board and method for manufacturing the same
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Application No.: US16421547Application Date: 2019-05-24
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Publication No.: US11382218B2Publication Date: 2022-07-05
- Inventor: Takaaki Morita , Seiichi Tajima , Takashi Kariya
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-102156 20180529
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K3/00 ; H05K3/10 ; H05K3/46 ; H01L21/02 ; H01L21/48 ; H01L21/56 ; H01L23/34 ; H01L23/52 ; H01L23/495 ; H05K3/40
Abstract:
In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.
Information query
