Invention Grant
- Patent Title: Metal-connected particle articles
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Application No.: US16264676Application Date: 2019-02-01
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Publication No.: US11383301B2Publication Date: 2022-07-12
- Inventor: Kristopher J. Erickson , Krzysztof Nauka , Thomas Anthony , Lihua Zhao , Howard S. Tom
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- Main IPC: B22F10/10
- IPC: B22F10/10 ; B33Y10/00 ; B82B1/00 ; B82B3/00 ; C23C18/30 ; C23C24/08 ; C23C24/10 ; C23C18/08
Abstract:
Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.
Public/Granted literature
- US20190160533A1 METAL-CONNECTED PARTICLE ARTICLES Public/Granted day:2019-05-30
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