Invention Grant
- Patent Title: High voltage (HV) terminal frame and method of manufacturing the same
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Application No.: US17092859Application Date: 2020-11-09
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Publication No.: US11387586B2Publication Date: 2022-07-12
- Inventor: Nicholas A. Durse , Joseph Sudik, Jr. , William C. Lovitz , Jeffrey A. Janis
- Applicant: Aptiv Technologies Limited
- Applicant Address: BB St. Michael
- Assignee: Aptiv Technologies Limited
- Current Assignee: Aptiv Technologies Limited
- Current Assignee Address: BB St. Michael
- Agency: Billion & Armitage
- Main IPC: H01R13/187
- IPC: H01R13/187 ; H01R43/16 ; H01R24/20 ; H01R13/11

Abstract:
A single-piece high voltage (HV) terminal frame includes a top wall, a bottom wall, and a side wall extending between the top wall and the bottom wall. The top wall includes a first top wall layer and an adjacently located second top wall layer. The side wall includes a first side wall layer and an adjacently located second side wall layer. The bottom wall includes a first bottom wall layer and an adjacently located second bottom wall layer. A single-layer contact spring extends from the first top wall layer, wherein the single-layer contact spring is bent to extend into a space located between the top wall and the bottom wall.
Public/Granted literature
- US20220149553A1 HIGH VOLTAGE (HV) TERMINAL FRAME AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-05-12
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