公开(公告)号：US11387586B2

公开(公告)日：2022-07-12

申请号：US17092859

申请日：2020-11-09

Applicant: Aptiv Technologies Limited

Inventor： Nicholas A. Durse ,  Joseph Sudik, Jr. ,  William C. Lovitz ,  Jeffrey A. Janis

IPC: H01R13/187 ,  H01R43/16 ,  H01R24/20 ,  H01R13/11

Abstract: A single-piece high voltage (HV) terminal frame includes a top wall, a bottom wall, and a side wall extending between the top wall and the bottom wall. The top wall includes a first top wall layer and an adjacently located second top wall layer. The side wall includes a first side wall layer and an adjacently located second side wall layer. The bottom wall includes a first bottom wall layer and an adjacently located second bottom wall layer. A single-layer contact spring extends from the first top wall layer, wherein the single-layer contact spring is bent to extend into a space located between the top wall and the bottom wall.

公开(公告)号：US20220149553A1

公开(公告)日：2022-05-12

申请号：US17092859

申请日：2020-11-09

Applicant: Aptiv Technologies Limited

Inventor： Nicholas A. Durse ,  Joseph Sudik, JR. ,  William C. Lovitz ,  Jeffrey A. Janis

IPC: H01R13/187 ,  H01R13/11 ,  H01R24/20 ,  H01R43/16

Abstract: A single-piece high voltage (HV) terminal frame includes a top wall, a bottom wall, and a side wall extending between the top wall and the bottom wall. The top wall includes a first top wall layer and an adjacently located second top wall layer. The side wall includes a first side wall layer and an adjacently located second side wall layer. The bottom wall includes a first bottom wall layer and an adjacently located second bottom wall layer. A single-layer contact spring extends from the first top wall layer, wherein the single-layer contact spring is bent to extend into a space located between the top wall and the bottom wall.

公开(公告)号：US11417979B2

公开(公告)日：2022-08-16

申请号：US16629824

申请日：2018-07-24

Applicant: Aptiv Technologies Limited

Inventor： William C. Lovitz ,  Patrick J. Reedy ,  Glenn E. Robison ,  Michael L. Mellott ,  Jeffrey A. Janis ,  Bruce D. Taylor ,  Steven P. Ragalyi ,  Christopher D. Hanton ,  Hoi Lui

IPC: H01R13/187 ,  H01R13/05 ,  H01R13/11 ,  H01R13/193 ,  H01R13/26 ,  H01R13/28 ,  H01R13/44 ,  H01R13/502 ,  H01R13/52 ,  H01R13/53 ,  H01R13/58 ,  H01R13/62 ,  H01R13/621 ,  H01R13/66 ,  H01R24/66 ,  H01R43/16 ,  H01R13/6581 ,  H01R13/6592 ,  H01R13/6598 ,  H01R4/50 ,  H01R13/207 ,  H01R13/633 ,  H01R13/40

Abstract: A shielded electrical connector assembly includes an electromagnetic shield integrally formed from a single sheet of conductive material. The shield has a main wall and four side walls surrounding the main wall. The shield defines an opening opposite the main wall having an opening perimeter that is greater than or equal to a main wall perimeter. One of the four side walls defines at least one side wall opening that is configured to receive a shielded wire cable. A method of manufacturing the shielded electrical connector assembly includes the steps of providing a single planar sheet of conductive material, providing a die and a punch, forming the sheet into a cupped shape having a main wall and four side walls surrounding the main wall using the die and the punch, and forming a side wall opening in one of the four side walls.