Invention Grant
- Patent Title: Film-like heat dissipation member, bendable display apparatus, and terminal device
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Application No.: US16851337Application Date: 2020-04-17
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Publication No.: US11406044B2Publication Date: 2022-08-02
- Inventor: Huipeng Wu , Quanming Li , Guo Yang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Priority: CN201710983771.0 20171020
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F3/02 ; G09F9/30

Abstract:
This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
Public/Granted literature
- US20200245501A1 FILM-LIKE HEAT DISSIPATION MEMBER, BENDABLE DISPLAY APPARATUS, AND TERMINAL DEVICE Public/Granted day:2020-07-30
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