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    Heat dissipation panel, heat dissipation apparatus, and electronic device
    1.
    发明授权
    Heat dissipation panel, heat dissipation apparatus, and electronic device 有权

    公开(公告)号：US11272639B2

    公开(公告)日：2022-03-08

    申请号：US16462826

    申请日：2017-02-07

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Guo Yang ,  Quanming Li ,  Xiaohu Liu ,  Wei Li ,  Zhiguo Zhang

    IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

    Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

    WIRELESS CHARGING DEVICE
    4.
    发明申请
    WIRELESS CHARGING DEVICE 有权

    公开(公告)号：US20210185854A1

    公开(公告)日：2021-06-17

    申请号：US16759890

    申请日：2018-10-27

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Jiajia Sui ,  Quanming Li ,  Guo Yang ,  Shuainan Lin

    IPC: H05K7/20 ,  H02J50/00 ,  H02J50/12 ,  H01F27/08 ,  H02J7/00

    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

    FILM-LIKE HEAT DISSIPATION MEMBER, BENDABLE DISPLAY APPARATUS, AND TERMINAL DEVICE
    5.
    发明申请
    FILM-LIKE HEAT DISSIPATION MEMBER, BENDABLE DISPLAY APPARATUS, AND TERMINAL DEVICE 审中-公开

    公开(公告)号：US20200245501A1

    公开(公告)日：2020-07-30

    申请号：US16851337

    申请日：2020-04-17

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Huipeng Wu ,  Quanming Li ,  Guo Yang

    IPC: H05K7/20 ,  F28F3/02 ,  G09F9/30

    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

    Film-like heat dissipation member, bendable display apparatus, and terminal device
    8.
    发明授权
    Film-like heat dissipation member, bendable display apparatus, and terminal device 有权

    公开(公告)号：US11406044B2

    公开(公告)日：2022-08-02

    申请号：US16851337

    申请日：2020-04-17

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Huipeng Wu ,  Quanming Li ,  Guo Yang

    IPC: H05K7/20 ,  F28F3/02 ,  G09F9/30

    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

    Heat-conducting assembly and terminal
    9.
    发明授权
    Heat-conducting assembly and terminal 有权

    公开(公告)号：US11284537B2

    公开(公告)日：2022-03-22

    申请号：US17031040

    申请日：2020-09-24

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yongfu Sun ,  Guo Yang ,  Quanming Li

    IPC: H05K7/20 ,  H04M1/02 ,  G06F1/20

    Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.

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