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公开(公告)号：US20220256739A1
公开(公告)日：2022-08-11
申请号：US17683698
申请日：2022-03-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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公开(公告)号：US11122710B2
公开(公告)日：2021-09-14
申请号：US16925433
申请日：2020-07-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
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公开(公告)号：US20200344915A1
公开(公告)日：2020-10-29
申请号：US16925433
申请日：2020-07-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
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公开(公告)号：US20210185854A1
公开(公告)日：2021-06-17
申请号：US16759890
申请日：2018-10-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jiajia Sui , Quanming Li , Guo Yang , Shuainan Lin
Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
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公开(公告)号：US20200245501A1
公开(公告)日：2020-07-30
申请号：US16851337
申请日：2020-04-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huipeng Wu , Quanming Li , Guo Yang
Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
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Patent Agency Ranking
公开(公告)号：US10729036B2
公开(公告)日：2020-07-28
申请号：US16337052
申请日：2017-09-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
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公开(公告)号：US11963336B2
公开(公告)日：2024-04-16
申请号：US17859034
申请日：2022-07-07
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huipeng Wu , Quanming Li , Guo Yang
CPC classification number: H05K7/20481 , F28F3/02 , G09F9/301 , H05K7/20963
Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
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公开(公告)号：US11847003B2
公开(公告)日：2023-12-19
申请号：US17130289
申请日：2020-12-22
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guo Yang , Tao Huang , Wenming Shi , Teng Long , Wei Li , Jianliang Wang , Zhiguo Zhang
CPC classification number: G06F1/203 , G06F1/1681 , G06F2200/203
Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.
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公开(公告)号：US11406044B2
公开(公告)日：2022-08-02
申请号：US16851337
申请日：2020-04-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huipeng Wu , Quanming Li , Guo Yang
Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
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公开(公告)号：US11284537B2
公开(公告)日：2022-03-22
申请号：US17031040
申请日：2020-09-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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