Invention Grant
- Patent Title: Prepreg, metal-clad laminate and printed wiring board
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Application No.: US16466979Application Date: 2017-12-07
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Publication No.: US11407869B2Publication Date: 2022-08-09
- Inventor: Keiko Kashihara , Rihoko Watanabe , Hiroharu Inoue
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2016-239719 20161209
- International Application: PCT/JP2017/043979 WO 20171207
- International Announcement: WO2018/105691 WO 20180614
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08K3/013 ; H05K1/03 ; H05K3/02
Abstract:
Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
Public/Granted literature
- US20200087474A1 PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2020-03-19
Information query
