Invention Grant
- Patent Title: Stress measuring device and stress measuring method
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Application No.: US16688993Application Date: 2019-11-19
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Publication No.: US11408730B2Publication Date: 2022-08-09
- Inventor: I-Hung Chiang , Hung-Hsien Ko , Cheng-Ta Pan , Wen-Yung Yeh , Cheng-Chung Lee
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW108140236 20191106
- Main IPC: G01B11/16
- IPC: G01B11/16 ; G01N3/24 ; G01L1/24

Abstract:
A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.
Public/Granted literature
- US20200158493A1 STRESS MEASURING DEVICE AND STRESS MEASURING METHOD Public/Granted day:2020-05-21
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