公开(公告)号：US11204240B2

公开(公告)日：2021-12-21

申请号：US16937592

申请日：2020-07-24

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Cheng-Ta Pan ,  Yu-Lin Hsu ,  Kuo-Hua Tseng

IPC: G01B11/16 ,  G01N21/88 ,  G06T7/55

Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

公开(公告)号：US20200158493A1

公开(公告)日：2020-05-21

申请号：US16688993

申请日：2019-11-19

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Cheng-Ta Pan ,  Wen-Yung Yeh ,  Cheng-Chung Lee

IPC: G01B11/16 ,  G01N3/24 ,  G01L1/24

Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.

公开(公告)号：US20240243097A1

公开(公告)日：2024-07-18

申请号：US18415677

申请日：2024-01-18

Applicant: Industrial Technology Research Institute

Inventor： Yu-Ming Peng ,  I-Hung Chiang ,  Chun-Kai Liu ,  Po-Kai Chiu ,  Hsin-Han Lin ,  Kuo-Shu Kao

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48155 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181

Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.

公开(公告)号：US20210356403A1

公开(公告)日：2021-11-18

申请号：US16937592

申请日：2020-07-24

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Cheng-Ta Pan ,  Yu-Lin Hsu ,  Kuo-Hua Tseng

IPC: G01N21/88

Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

公开(公告)号：US12232256B2

公开(公告)日：2025-02-18

申请号：US17585574

申请日：2022-01-27

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Min-Hsiung Liang ,  Te-Hsun Lin ,  Chen-Tsai Yang ,  Hao-Wei Yu

IPC: H05K1/02 ,  A61B5/00 ,  H05K1/03 ,  H05K3/32

Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

公开(公告)号：US20210404795A1

公开(公告)日：2021-12-30

申请号：US17033694

申请日：2020-09-26

Applicant: Industrial Technology Research Institute

Inventor： Wan-Hsin Chen ,  Hung-Hsien Ko ,  Chang-Ying Chen ,  I-Hung Chiang

IPC: G01B11/16 ,  G06T7/00

Abstract: A compression state measuring method is adapted to measure a compressed state of a compressed object compressed by a compressing object. First, at least one image of a first surface region of the compressed object not covered by the compressing object is captured. A first strain distribution value of the first surface region is obtained according to the at least one image. At least one strain distribution function is obtained according to the first strain distribution value. A second strain distribution value of a second surface region of the compressed object covered by the compressing object is obtained according to the at least one strain distribution function.

公开(公告)号：US20230147556A1

公开(公告)日：2023-05-11

申请号：US17585574

申请日：2022-01-27

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Min-Hsiung Liang ,  Te-Hsun Lin ,  Chen-Tsai Yang ,  Hao-Wei Yu

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L23/49822

Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

公开(公告)号：US11408730B2

公开(公告)日：2022-08-09

申请号：US16688993

申请日：2019-11-19

Applicant: Industrial Technology Research Institute

Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Cheng-Ta Pan ,  Wen-Yung Yeh ,  Cheng-Chung Lee

IPC: G01B11/16 ,  G01N3/24 ,  G01L1/24

Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.