Invention Grant
- Patent Title: Thermal conductivity measuring device, heating device, thermal conductivity measuring method, and quality assurance method
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Application No.: US16559746Application Date: 2019-09-04
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Publication No.: US11408841B2Publication Date: 2022-08-09
- Inventor: Yohei Fujikawa
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-167064 20180906
- Main IPC: G01N25/18
- IPC: G01N25/18 ; G01K13/12 ; G01J5/12 ; G01K1/143 ; G01K7/08
Abstract:
A thermal conductivity measuring device includes a sample container that has a plurality of storage sections; a drive unit that is configured to move the plurality of storage sections of the sample container; and a radiation thermometer that is configured to measure the temperature of a predetermined position of the sample container.
Public/Granted literature
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