Invention Grant
- Patent Title: Power management in a logic circuitry package
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Application No.: US16959397Application Date: 2019-10-25
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Publication No.: US11409487B2Publication Date: 2022-08-09
- Inventor: James Michael Gardner , Stephen D. Panshin
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2019/058189 WO 20191025
- International Announcement: WO2021/080620 WO 20210429
- Main IPC: G06F3/12
- IPC: G06F3/12 ; B41J2/00 ; G06F21/00 ; G06K15/00 ; H03K19/00 ; B41J2/175

Abstract:
A logic circuitry package for a replaceable print apparatus component includes an interface including a power terminal and at least one logic circuit. The at least one logic circuit is configured to respond to communications sent to a first address via the interface and respond to communications sent to a second address via the interface. The at least one logic circuit is configured to in response to a first command sent to the first address, draw a first current on the power terminal; and in response to a hibernate command sent to the first address, respond to communications sent to the second address and draw a second current on the power terminal less than the first current.
Public/Granted literature
- US20210405946A1 LOGIC CIRCUITRY PACKAGE Public/Granted day:2021-12-30
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