Invention Grant
- Patent Title: Brass-coated metals in flip-chip redistribution layers
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Application No.: US16721546Application Date: 2019-12-19
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Publication No.: US11410947B2Publication Date: 2022-08-09
- Inventor: Vivek Swaminathan Sridharan , Christopher Daniel Manack , Nazila Dadvand , Salvatore Frank Pavone , Patrick Francis Thompson
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer. The package is a wafer chip scale package (WCSP). The package further includes a solder ball attached to the redistribution layer.
Public/Granted literature
- US20210193600A1 BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS Public/Granted day:2021-06-24
Information query
IPC分类:
