Invention Grant
- Patent Title: Finger-mounted device with sensors and haptics
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Application No.: US17094653Application Date: 2020-11-10
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Publication No.: US11416076B2Publication Date: 2022-08-16
- Inventor: Paul X. Wang , Alex J. Lehmann , Michael J. Rockwell , Michael Y. Cheung , Ray L. Chang , Hongcheng Sun , Ian M. Bullock , Kyle J. Nekimken , Madeleine S. Cordier , Seung Wook Kim , David H. Bloom , Scott G. Johnston
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Kendall P. Woodruff
- Main IPC: G06F3/01
- IPC: G06F3/01 ; G06F3/04815 ; G06F3/042 ; G06F3/04886 ; G06T19/00 ; G01P15/00 ; G02B27/01 ; G06F3/0346

Abstract:
A finger-mounted device may include finger-mounted units. The finger-mounted units may each have a body that serves as a support structure for components such as force sensors, accelerometers, and other sensors and for haptic output devices. The body may have sidewall portions coupled by a portion that rests adjacent to a user's fingernail. The body may be formed from deformable material such as metal or may be formed from adjustable structures such as sliding body portions that are coupled to each other using magnetic attraction, springs, or other structures. The body of each finger-mounted unit may have a U-shaped cross-sectional profile that leaves the finger pad of each finger exposed when the body is coupled to a fingertip of a user's finger. Control circuitry may gather finger press input, lateral finger movement input, and finger tap input using the sensors and may provide haptic output using the haptic output device.
Public/Granted literature
- US20210055799A1 Finger-Mounted Device With Sensors and Haptics Public/Granted day:2021-02-25
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