Invention Grant
- Patent Title: Power supply housing adapted to redundant power module
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Application No.: US16740725Application Date: 2020-01-13
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Publication No.: US11429162B2Publication Date: 2022-08-30
- Inventor: Chun-Lung Su , Tzung-Han Lee
- Applicant: ZIPPY TECHNOLOGY CORP.
- Applicant Address: TW New Taipei
- Assignee: ZIPPY TECHNOLOGY CORP.
- Current Assignee: ZIPPY TECHNOLOGY CORP.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/18 ; G06F1/26 ; G06F1/3203

Abstract:
A power supply housing adapted to a redundant power module includes a casing, a separation member, two front plates and a back plate. The casing includes four side plates and an installation space defined by the side plates. The separation member divides the installation space into a first sub-space and a second sub-space, and includes two first baffles located in the first sub-space and two second baffles located in the second sub-space. The two first baffles define a first installation region for disposing a redundant power module, and the two second baffles define a second installation region for disposing the redundant power module. The front plates are disposed on one end of the installation space and define a placement opening, serving as an entrance of the first and the second installation region. The back plate is disposed on one end of the installation space not provided with the front plates.
Public/Granted literature
- US20210216115A1 POWER SUPPLY HOUSING ADAPTED TO REDUNDANT POWER MODULE Public/Granted day:2021-07-15
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