Invention Grant
- Patent Title: Package substrate
-
Application No.: US17025939Application Date: 2020-09-18
-
Publication No.: US11432406B2Publication Date: 2022-08-30
- Inventor: Wu Chou Hsu , Hsing Kuo Tien , Chih-Cheng Lee , Min-Yao Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H02K5/04
- IPC: H02K5/04 ; H02K33/00 ; H05K3/30 ; H01L21/00 ; H01L21/56 ; H01L23/10 ; H01L23/498 ; H01L23/544 ; H05K1/18 ; H05K1/02 ; H01L21/48
Abstract:
A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.
Public/Granted literature
- US20220095462A1 PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-03-24
Information query
