An aqueous solution for etching silicon dioxide and method of use are provided. The aqueous solution includes the anion F− in a concentration ranging from 2 to 4 mol/l and a cation of formula RR′R″R′″N+ in a concentration ranging from 1.5 to 2 mol/l, wherein each of R, R′, R″, and R′″ are independently selected from hydrogen and C1-5 alkyl chains with the proviso that the total number of carbon atoms in R, R′, R″, and R′″ combined equals from 8 to 16.